Pure PCB's HDI Technology (High Density Interconnect) enables PCB designers to create increasingly complex designs with optimal layout formats across a wide range of technologies.
Combining fine track and gap features along with laser-drilled blind or buried microvia technology, allows interconnection of one PCB layer to another using the smallest pad diameter possible; in turn allowing greater flexibility of board design through increased real estate utilisation on the circuit.
With via sizes of typically =< 150µm, with a pad diameter requirement of typically =< 300µm, Pure PCB offers a full suite of Microvia Technology from single microvia, through to stacked via, epoxy filled and copper plated over the top including solid copper fill & plated shut.
Examples of Pure Electronics Microvia Solutions are shown below.
Blind & Buried Microvia